PART |
Description |
Maker |
ZL60001TBD ZL60001 |
High speed 2.5 Gbps 850 nm VCSEL
|
ZARLINK[Zarlink Semiconductor Inc]
|
907-0010 912-0120 914-0040 914-0070 914-0140 912-0 |
PUNCH&DIE SET 3-12MM PUNCH&DIE 10.0MM CIRCULAR PUNCH&DIE 16.5MM CIRCULAR PUNCH&DIE 25.0MM CIRCULAR PUNCH&DIE 12.0MM CIRCULAR PUNCH&DIE 9.0MM CIRCULAR PUNCH&DIE 20.0MM CIRCULAR PUNCH&DIE 12.5MM CIRCULAR STRIPPER 37.0 X 13.7 D CON STRIPPER 31.75MM DIAMETER 低产31.75MM直径 LOUVRE TOOL 卢浮宫工 PUNCH&DIE 10.0MM CIRCULAR STRIPPER 67.2 X 16.5 D CON
|
Peregrine Semiconductor, Corp. Molex, Inc.
|
V23818-N15-L356 V23818-N15-L356-C V23818-M305-L57 |
Small Form Factor Multimode 850 nm 2.125 and 1.0625 GBd Fibre Channel 2x5 Transceiver with LCConnector Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x10 Pinning with LC Connector/ with Collar Transceivers by Form-factor MSA - Multimode 850nm VCSEL TRX Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x5/2x10 Pinning with LC Connector SMALL FORM FACTOR MULTIMODE 850 NM 2.125 AND 1.0625 GBD FIBRE CHANNEL 2X5 TRANSCEIVER WITH LC⒙ CONNECTOR Small Form Factor Multimode 850 nm 2.125 and 1.0625 GBd Fibre Channel 2x5 Transceiver with LC Connector
|
Infineon Technologies AG
|
1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
AM29BL802C_03 AM29BL802C AM29BL802CB80DGE1 AM29BL8 |
Am29BL802C (Known Good Die Supplement) 8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1
|
Advanced Micro Devices SPANSION[SPANSION]
|
LH-FSLH-S090C-0406A FSLH-S090C |
850 MHz - 950 MHz RF/MICROWAVE SPLITTER AND COMBINER, 1 dB INSERTION LOSS 2012 Size 850/950 MHz Chip Multilayer Splitter/Combiner
|
HITACHI METALS LTD HIROSE[Hirose Electric] Hirose Electric USA, INC.
|
10GBPS-VCSEL |
10 Gbps VCSEL
|
EMCORE Corporation
|
PX5419A |
12 x 3.6 Gb/s VCSEL Driver with ACJTAG
|
Zarlink Semiconductor Inc
|
PX6419 |
12x10 Gb/s VCSEL Driver
|
Zarlink Semiconductor Inc
|
VG1A-1000 |
850nm VCSEL Epiwafer
|
LuxNet Corporation
|